Bisphenol S-BPA phenolic epoxy resin was synthesized using bisphenol A phenolic resin (BPA phenolic resin) and 4, 4-dihydroxydiphenyl sulfone (BPS) under the bridge of epichlorohydrin and the Catalysis of tetrabutylammonium bromide (TBAB). Then, its chemical structure and molecular weight were character-ized by FTIR, 1H NMR, GPC, energy spectrum analysis, etc. The results showed that the target product was successfully prepared and showed good temperature resistance, and its Mw was 4355. In addition, the effects of reaction temperature, reaction time, material ratio and NaOH content on the epoxy value of the target product were also discussed. The optimum process conditions for the target product obtained by or-thogonal experimental design are: reaction temperature 110 ?C, reaction time 2.5 h, material ratio 1:0.9, NaOH content 18 ml. Under these conditions, the epoxy value of the synthesized product was 0.718%. Finally, an adhesive was obtained by adding a curing agent to the target product. This adhesive has excel-lent bonding properties. It displays a maximum adhesion of 100.66 N and an interlayer bonding strength of 0.788 N.m, which exhibits good adhesion to low-polarity polypropylene materials.