文章摘要
李金旺.金刚石/铜高导热复合材料制备工艺的研究进展[J].精细化工,2019,36(10):
金刚石/铜高导热复合材料制备工艺的研究进展
Progress in Preparation Methods of High thermal conductivity Diamond/Copper Composite Material
投稿时间:2019-03-26  修订日期:2019-05-27
DOI:
中文关键词: 金刚石/铜,复合材料,制备方法,高热导率,界面结合
英文关键词: diamond/copper  composites  preparation method  high thermal conductivity  interface bonding
基金项目:国家自然科学基金项目(面上项目,重点项目,重大项目)
作者单位E-mail
李金旺 南京航空航天大学 ljw@nuaa.edu.cn 
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中文摘要:
      金刚石/铜复合材料具有优异的高导热性能,有望可用来解决未来高热流密度电子器件封装和散热难题。该文从金刚石/铜复合材料的制备方法、导热性能的影响因素和关键的界面有效结合问题三个方面出发,归纳了热压烧结法、高温高压烧结法、放电等离子烧结法以及熔渗法制备金刚石/铜复合材料的详细制备工艺。金刚石颗粒参数和烧结工艺参数对金刚石/铜复合材料的导热性能有着重要影响。通过金刚石表面预金属化和铜基体合金化两方面可以加强金刚石/铜界面的结合。这些方面的进一步研究以及金刚石/铜高导热复合材料的应用是未来的研究重点。
英文摘要:
      Diamond/copper composites have high thermal conductivity, and they can be used to solve the problems of packaging and heat dissipation of future high heat flux electronic component. They have attracting more and more attention. In this paper, the manufacturing methods of diamond/copper composites, the influencing factors of thermal conductivity and interface problems are reviewed. Four main preparation processes, including hot pressing sintering, high temperature and high pressure sintering, spark plasma sintering and infiltration, are summarized. Diamond particle parameters and sintering process parameters have important effects on the thermal conductivity of diamond/copper composites materials. There are two methods to solve the interface problems of diamond indicate premetallization and copper matrix alloying. The above topics and the applications are the emphasis and development trend of diamond/copper composites in the future.
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