In order to improve the heat resistance and coating adhesion of waterborne varnish, butyl acrylate (BA) and methyl methacrylate (MMA) were used to design emulsion particles for soft and hard monomers, respectively, low Tg and high Tg acrylate emulsions with different glass transition temperature (Tg) values were prepared by adjusting the addition ratio of BA and MMA, and low Tg and high Tg silicon-acrylic emulsions were prepared by using γ-methacryloyloxypropyltrimethoxysilane (KH570) as cross-linked monomer modified acrylate emulsions. The compound emulsion was prepared by hard emulsion compounding, and finally the low-Tg, high-Tg silicon-acrylic emulsion and compound emulsion were used as water-based varnish binders to prepare water-based varnish. Based on SEM, TGA, DSC and tensile experiments, the effects of KH570 dosage (the mass percentage based on the total mass of polymeric monomer, the same below) on the properties of soft and hard silicon acrylic emulsions and water-based varnishes were investigated. The results showed that the average particle size of the low-Tg silicon-acrylic emulsion (dSiPA-3) prepared with KH570 dosage of 3% was 116.5 nm, the minimum film-forming temperature (MFT) was 16.6 °C, the water contact angle of the latex film was 68.6°, Tg=14.25 °C, the water resistance of water-based varnish was up to 50 times, the coating adhesion was grade 0, and the high temperature and anti-adhesion resistance could reach 150 °C. When dSiPA-3 is mixed with gSiPA-3 at the mass ratio of 0.8∶1, the MFT of the mixed emulsion is 33.8 ℃, the Tg of the latex film is 14.19 and 63.54 ℃, the water contact Angle is 77.9°, and the water-based gloss oil is resistant to friction for 500 times and water for 50 times. High temperature resistance and anti-adhesion temperature can reach 210 ℃, coating adhesion level 0.