Abstract: The electroless copper plating was studied in a bath consisting of sodium hypophosphite as reducing agent, 2, 2′-dipyridyl and K4Fe(CN)6 as additives. The effect of various additives on the deposits was systematically investigated in this paper. The electrochemical analysis showed that oxide potential was increased by addition of 2, 2′-dipyridyl and K4Fe(CN)6 additives. On the contrary, the oxide potential was decreased. Furthermore, the deposits were characterized by scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction (XRD) and four-probe method. Compare with single additive, the compound additive (10 mg/L 2, 2′-dipyridyl and 4 mg/L) showed higher purity of deposit (w（Cu)= 96.27 %), brighter and more compact deposit surface. In addition, the surface resistivity of the deposits was as low as 0.0229 μΩ• m.