Dicyandiamide is commonly used as curing agent in epoxy resin. A new latent curing agent for epoxy resin was synthesized to improve the comprehensive performance of dicyandiamide curing agent. The chemical structure of curing agent was characterized by FTIR,1H NMR. The optimum ratio of epoxy resin and curing agent was 5:1 under the assistance of DSC. The optimum curing temperature and storage time in room temperature was 130 ℃ and 30 d obtained by curing activity test and gel test, respectively. Tensile strength of cured epoxy resin was 38.07 MPa, which is analyzed by tesion test. Thermal decomposition temperature of the cured epoxy was exceeded 270 ℃ with the help of TG. Comparing with dicy/epoxy resin curing system, the new agent has better compatibility with epoxy resin. Its latency performance was fine and curing temperature was decreased more than 30 ℃ and the cured epoxy has excellent mechanical properties and good thermostabilities.