In this work, Bisphenol F epoxy acrylate prepolymer was prepared by using Bisphenol F epoxy resin and acrylic acid as raw materials, followed by mixing with diluent TPGDA and photoinitator BDK at the ratio of 70%︰26%︰4% to produce photosensitive bisphenol F resin. Its Shrinkage ratio and gel content were studied to for the optimum synthesis process. The orthogonal experiment results showed that, at 100℃, with 1.0% tetramethyl ammonium chloride as the catalyst, 0.1% bisphenol as polymerization inhibitor and the mass ratio of 1:0.8 between epoxy resin and acrylic acid, bisphenol F photosensitive resin’s shrinkage ratio was 5.05% after 4 hours’ reaction, which was 30% lower than Bisphenol A epoxy resin. The gel content was 92.25%, which was 3% higher than Bisphenol A epoxy resin. Meanwhile, the sensitivity to UV light and sensitivity and absorption capacity to UV were also improved. It can be used for 3D printing.