Aluminium nitride (AlN)/epoxy thermal conductive adhesive was prepared with epoxy as matrix material, AlN as thermal conductive filler. The structure and properties of adhesive were characterized using fourier transform infrared spectrometer, scanning electron microscopy, thermal gravimetric analyzer and thermal constants analyzer. The experimental results showed that coupling agent molecule was successfully chemically grafted onto the AlN surface. Modified AlN had strong interface adhesion with epoxy. The thermal stability and thermal conductivity of epoxy adhesive can be significantly improved by modified AlN. When the AlN mass fraction was 70%, the thermal conductivities of modified AlN/epoxy and AlN/epoxy adhesive were 2.24 W/(m.K) and 1.73 W/(m.K), respectively. In order to further improve thermal conductivity, hybrid filler of modified AlN and graphene oxide (GO) was employed to prepare thermal conductive adhesive. When the mass fractions of modified AlN and GO were 50% and 3%, the thermal conductivity of epoxy adhesive reached 3.05 W/(m.K).