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第 35 卷第 9 期 精 细 化 工 Vol.35, No.9
201 8 年 9 月 FINE CHEMICALS Sept. 2018

功能材料
纳米银线-石墨烯复合物对导电胶性能的影响

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刘银花 ，李 莉 ，欧阳新平 ，袁文辉
(1. 华南理工大学 化学与化工学院，广东 广州 510640；2. 华南理工大学 环境与能源学院，广东 广州
510006)
摘要：以氧化石墨烯、硝酸银和乙二醇为原料，采用一步溶剂热法合成了纳米银线-石墨烯复合物，通过 FTIR、
XRD、SEM、TEM 和 UV-Vis 对合成的复合物进行了结构及形貌的表征，并将复合物应用于导电胶中，考察了
其导电性能和热稳定性能。结果表明：该复合物可改善导电胶的导电性，且不会减弱其热稳定性。当复合物的
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质量分数达到 0.9%时，导电胶的体积电阻率低至 4.34×10 Ω·cm，与空白样相比降低了 79%；而且导电胶的热
分解温度约为 350 ℃，和纯环氧树脂的热分解温度相近。
关键词：纳米银线；石墨烯；溶剂热法；导电胶；体积电阻率；热稳定性；功能材料
中图分类号：TB33 文献标识码：A 文章编号：1003-5214 (2018) 09-1466-06

Effects of Silver Nanowires-Graphene Nanocomposites on the
Performance of Electrically Conductive Adhesive

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LIU Yin-hua , LI Li , OUYANG Xin-ping , YUAN Wen-hui
(1. School of Chemistry and Chemical Engineering, South China University of Technology, Guangzhou 510640,
Guangdong, China; 2. College of Environmental Science and Engineering, South China University of Technology,
Guangzhou 510006, Guangdong, China)
Abstract: Silver nanowires-graphene nanocomposites (AgNWs-GNs) were successfully fabricated via a
facile solvothermal synthetic method with graphene oxide (GO), silver nitrate and ethylene glycol (EG) as
raw materials. The structure and morphology of the as-prepared nanocomposites were characterized by
FTIR, XRD, SEM, TEM and UV-Vis. Different amounts of AgNWs-GNs were introduced into electrically
conductive adhesives (ECAs) to study the effects of AgNWs-GNs on the electrical and thermal properties of
ECAs. The results showed that AgNWs-GNs could significantly improve the electrical conductivity of
ECAs. Moreover, the ECAs filled AgNWs-GNs still possessed good thermal stability. The electrically
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conductive adhesive containing 0.9% AgNWs-GNs had the lowest volume resistivity of 4.34×10 Ω·cm,
which was a decrease of 79% compared with that of blank sample. In addition, the initial decomposition
temperature of this electrically conductive adhesive was about 350℃, close to that of the pure epoxy.
Key words: silver nanowires; graphene; solvothermal; electrically conductive adhesive; volume resistivity;
thermal stability; functional materials
Foundation items: Natural Science Foundation of Guangdong Province (2016A030313475); Dongguan
Science and Technology Project (201521510201); Project of Science and Technology of Guangdong
Province (2015B010135009)

科学技术的日益发展对电子产品的封装技术提 超细间距连接、处理温度低、工艺简单和易于操作等
出了更高的要求，传统的锡铅（Sn/Pb）焊料，使用 优点的导电胶必将成为 Sn/Pb 焊料的最佳替代品 [1-4] 。
温度较高，分辨率较低，已经不能满足目前电子封 但是，目前商用导电胶的导电性仍比较差，不能完
装技术的要求。因此，具有无铅污染、环境友好、 全代替传统的 Sn/Pb 焊料。

收稿日期：2017-09-28; 定用日期：2018-01-22; DOI: 10.13550/j.jxhg.20170784
基金项目：广东省自然科学基金（2016A030313475）；东莞市重大科技专项（201521510201）；广东省科技专项（2015B010135009）
作者简介：刘银花（1992—），女，硕士生。联系人：袁文辉（1969—），男，研究员，博士生导师，电话：020-87111887，E-mail：
cewhyuan@scut.edu.cn。