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第 10 期                   戴书刚,等:  金刚石/铜高导热复合材料制备工艺的研究进展                                  ·2007·


            [3]   Kerns  J,  Colella  N,  Makowiecki  D,  et al.  Dymalloy:  A  composite   303-308.
                 substrate  for  high  power  density  electronic  components[C]//1995   [21]  Yan  Qiushi  (闫秋实).  Research  progress  of  spark  plasma  sintering
                 International  Symposium  on  Microelectronics,  Bellingham:  Proc   process[J].Science  and Technology Innovation Herald (科技创新导
                 SPIE, 1995: 66-72.                                报), 2016, 13(31): 36-37.
            [4]   Deng Lifang (邓丽芳), Zhu Xinkun (朱心昆), Tao Jingmei (陶静梅),   [22]  Wang Song (王松), Xie Ming (谢明), Zhang Jiming (张吉明), et al.
                 et al.  Application  of  active  element  to  Cu/diamond  composites[J].   Development  of  spark  plasma  sintering  technology[J].Precious
                 Electronics Process Technology (电子工艺技术), 2009, 30(3): 128-   Metals (贵金属), 2012, 33(3): 73-77.
                 132.                                          [23]  Wang Qingfu (王庆福), Zhang Yanmin (张彦敏), Guo Xiuhua (国秀
            [5]   Zhao Yanbing (赵妍冰), Liu Keming (刘克明), Lu Deping (陆德平),   花),  et al.  The  latest  development  and  research  progress  of  spark
                 et al. Research status and prospect of CD/Cu composite for electronic   plasma  sintering  process[J].Rare  Metals  and  Cemented  Carbides
                 packaging material[J] . Heat Treatment Technology and Equipment   (稀有金属与硬质合金), 2014, 42(3): 44-47.
                 (热处理技术与装备), 2013, 34(6): 31-36.               [24]  Ji  Bifa  (季必发),  Tian  Changan  (田长安), Xie Jinsong (谢劲松).
            [6]   Hou  Yaping  ( 侯亚 平 ).  Preparation  and  performance  study  of   Progress and trend of spark plasma sintering process technology in
                 diamond/Cu composite with high thermal conductivity for packaging[D].   China[J]. Guangdong Chemical Industry (广东化工), 2013, 40(15):
                 Changsha: Central South University (中南大学), 2007.   85-86.
            [7]   Gao Wenjia (高文迦), Jia Chengchang (贾成厂), Chu Ke (褚克), et   [25]  Deng  Jiali  (邓佳丽).  Study  on  surface  metallized  diamond/copper
                 al. Research and advances of diamond/metal composites for thermal   composites fabricated by spark plasma sintering method in electronic
                 management  materials[J].  Materials  Review  (材料导报),  2011,   packaging industry[D]. Shanghai: Shanghai Jiao Tong University (上
                 25(2):17-22, 26.                                  海交通大学), 2016.
            [8]   Fang  Zhenzheng  ( 方针正 ),  Lin  Chenguang  ( 林晨光 ),  Zhang   [26]  Schubert T, Ciupiński Ł, Zieliński W, et al. Interfacial characterization of
                 Xiaoyong  (张小勇),  et al.  Properties  and  application  of  diamond/   Cu/diamond composites prepared by powder metallurgy for heat sink
                 metal composites for electronic packaging[J]. Materials Review (材  applications[J].  Materials  Science  &  Engineering  A,  2008,  58(4):
                 料导报), 2008, 22(3): 36-39.                         263-266.
            [9]   Chen Hui (陈惠), Jia Chengchang (贾成厂), Chu Ke (褚克), et al.   [27]  Zhu Congxu (朱聪旭), Shen Zhengyuan (申铮源), Wu Xiwang (武
                 Research  on  increasing  thermal  conductivity  of  diamond/copper   玺旺),  et al.  Study  on  thermal-physical  property  of  Cr-coated
                 composites  by  improving  the  interface  condition[J].  Powder   diamond  particle  reinforced  copper  matrix  composite[J].New
                 Metallurgy Technology (粉末冶金技术), 2010, 28(2): 143-149.   Chemical Materials (化工新型材料), 2018, 46(4): 66-69.
            [10]  Lin  Jinmei  (林金梅).  Research  on  fabrication  and  properties  of   [28]  Wang Y, Duan K, Wang K, et al. Structure and thermal properties of
                 diamond/ copper composites[D]. Nanjing: Southeast University (东  layered Ti-clad diamond/Cu composites prepared by SPS and HP[J].
                 南大学), 2014.                                       Rare Metal Materials and Engineering, 2018, 47(7): 2011-2016.
            [11]  Zhao  Yongzhi  (赵勇智),  Li  Ying  (李颖).  Thermal  conductivity  of   [29]  Tao J M, Zhu X K, Tian W W, et al. Properties and microstructure of
                 diamond/copper  composites  prepared  using  powder  metallurgy[J].   Cu/diamond  composites  prepared  by  spark  plasma  sintering
                 Diamond & Abrasives Engineering (金刚石与磨料磨具工程), 2016,   method[J].  Transactions  of  Nonferrous  Metals  Society  of  China,
                 36(1): 79-82,90.                                  2014, 24(10): 3210-3214.
            [12]  Yan  Jianming  (闫建明).  Study  on  interface  control  and  thermal   [30]  Gan  Zuoteng  (淦作腾),  Ren  Shubin  (任淑彬),  Shen  Xiaoyu  (沈晓
                 conductivityof  diamond/Cu  composites[D].  Zhengzhou:  Zhengzhou   宇), et al. Research on diamond/Cu composites fabricated by spark
                 University (郑州大学), 2018.                          plasma  sintering[J].Materials  Science  and  Engineering  of  Powder
            [13]  Shen W, Shao W, Wang Q, et al. Thermal conductivity and thermal   Metallurgy (粉末冶金材料科学与工程), 2010, 15(1): 59-63.
                 expansion coefficient of diamond/5wt%Si–Cu composite by vacuum   [31]  Dong Yinghu (董应虎), Gan Haichao (甘海潮), Zhang Ruiqing (张
                 hot  pressing[J].  Fusion  Engineering  and  Design,  2010,  85(10):   瑞卿),  et al.  Effect  of  W  on  microstructure  and  properties  of
                 2237-2240.                                        diamond/Cu  composites[J].Transactions  of  Materials  and  Heat
            [14]  Schubert  T,  Trindade  B,  Weißgärber  T,  et al.  Interfacial  design  of   Treatment (材料热处理学报), 2015, 36(S2): 18-22.
                 Cu-based  composites  prepared  by  powder  metallurgy  for  heat  sink   [32]  Zhao Long (赵龙), Song Pingxin (宋平新), Zhang Yingjiu (张迎九),
                 applications[J]. Materials Science and Engineering: A, 2008, 475(1):   et al.  Study  on  preparation  of  diamond/copper  composites  by  high
                 39-44.                                            temperature  and  high  pressure  method[J].Diamond  &Abrasives
            [15]  Zhang  C,  Wang  R,  Cai  Z,  et al.  Effects  of  dual-layer  coatings  on   Engineering (金刚石与磨料磨具工程), 2018, 38(2): 15-19.
                 microstructure and thermal conductivity of diamond/Cu composites   [33]  Ekimov E A, Suetin N V, Popovich A F, et al. Thermal conductivity
                 prepared by vacuum hot pressing[J]. Surface & Coatings Technology,   of diamond composites sintered under high pressures[J]. Diamond &
                 2015, 277: 299-307.                               Related Materials, 2008, 17(4): 838-843.
            [16]  Hu Meihua (胡美华), Yu Kunpeng (于昆鹏), Bi Ning (毕宁), et al.   [34]  He Jinshan (何金珊), Zhang Hailong (张海龙), Zhang Yang (张洋),
                 Effect  of  diamond  size  on  properties  of  particles  reinforced   et al. Thermal conductivity of Cu/diamond composites produced by
                 diamond/Cu  composites[J].Journal  of Functional  Materials  (功能材  high  pressure  liquid  infiltration  method[J].Chinese  Journal  of
                 料), 2018, 49(1): 1059-1063.                       Materials Research (材料研究学报), 2014, 28(5): 321-324.
            [17]  Liu Qiuxiang (刘秋香), Dong Guixia (董桂霞), Chen Hui (陈惠), et   [35]  He  J,  Wang  X,  Zhang  Y,  et al.  Thermal  conductivity  of
                 al.  Performance  study  on  diamond/copper  composite  prepared  by   Cu–Zr/diamond  composites  produced  by  high  temperature–high
                 ultrahigh pressure sintering[J]. Materials Review (材料导报), 2013,   pressure method[J]. Composites Part B, 2015, 68(68): 22-26.
                 27(24): 66-69.                                [36]  Li Jianwei (李建伟), Zhang Hailong (张海龙), Zhang Shaoming (张
            [18]  Xia Yang (夏扬), Xie Yuanfeng (谢元锋), Song Yueqing (宋月清), et   少明), et al. On the thermal conductivity of Cu/diamond composite
                 al.  Investigation  on  diamond-Cu  composites  prepared  by  HTHP   of diamond particles with tungsten coating[J].Journal of Functional
                 sintering process[J].Diamond & Abrasives Engineering (金刚石与磨  Materials (功能材料), 2016, 47(1): 1034-1037.
                 料磨具工程), 2010, 30(6): 44-49.                   [37]  Hong Qingnan (洪庆楠), Ren Shubin (任淑彬), Chen Zhibao (陈志
            [19]  Zhang Wenkai (张文凯), Peng Fang (彭放), Guo Zhentang (郭振堂),   宝), et al. Effects of Co on properties of diamond /Cu composites by
                 et al.  Research  on  thermal  conductivity  of  diamond  with  Cr,  Ti   infiltration[J].Powder  Metallurgy  Technology  ( 粉末 冶金 技 术 ),
                 coating/copper  composite  materials  by  sintering  under  high   2015, 33(1): 49-53, 57.
                 pressure[J]. Chinese Journal of High Pressure Physics (高压物理学  [38]  Guo Hong (郭宏), Wang Guangzong (王光宗), Jia Chengchang (贾
                 报), 2012, 26(3): 306-312.                         成厂),  et al.  Low-temperature  heat  conduction  characteristics  of
            [20]  Yoshida  K,  Morigami  H.  Thermal  properties  of  diamond/copper   diamond/Cu composite by high pressure infiltration[J].Acta Materiae
                 composite  material[J].  Microelectronics  Reliability,  2004,  44(2):   Compositae Sinica (复合材料学报), 2014, 31(3): 550-555.
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