Page 201 - 精细化工2020年第2期

第 37 卷第 2 期 精 细 化 工 Vol.37, No.2
202 0 年 2 月 FINE CHEMICALS Feb. 2020

粘合剂
BPS-BPA 酚醛环氧树脂的合成及其应用性能

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郭 睿 ，李秀环 ，何观伟 ，刘雪艳 ，霍文生 ，冯文佩
（1. 陕西科技大学 教育部轻化工助剂化学与技术重点实验室，陕西 西安 710021；2. 西北化工研究院
有限公司，陕西 西安 710061）
摘要：以双酚 A 环氧树脂（BPA 酚醛树脂）和 4,4-二羟基二苯砜（BPS）为原料，环氧氯丙烷为桥连剂，在四
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丁基溴化铵（TBAB）的催化作用下合成了 BPS-BPA 酚醛环氧树脂（目标产物）。采用 FTIR、 HNMR、GPC、
EDS 等对产物的化学结构及分子量进行测试。结果表明，产物 M w 为 4355 且表现出较好的耐温性能，此外还探
讨了反应温度、反应时间、物料配比、NaOH 用量等因素对目标产物环氧值的影响。利用正交实验设计获得了
目标产物的最佳工艺条件为：反应温度 110 ℃，反应时间 2.5 h，m(BPA 酚醛树脂)∶m(BPS)=1∶0.9，NaOH 用
量 1.98 g，在该条件下合成产物的环氧值为 0.718。最后向目标产物中加入聚酰胺树脂固化剂，得到的胶粘剂具
有优良的粘结性能，其最大粘结力达 100.66 N，层间结合强度 0.788 N/m，对低极性聚丙烯材料具有很好的附着
性能。
关键词：4,4-二羟基二苯砜；双酚 A 酚醛树脂；环氧值；粘结性能
中图分类号：O621.3；TQ323.5 文献标识码：A 文章编号：1003-5214 (2020) 02-0403-09

Synthesis and application properties of BPS-BPA phenolic epoxy resin

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Guo Rui , Li Xiuhuan , He Guanwei , Liu Xueyan , Huo Wensheng , Feng Wenpei
（1. MOE Key Laboratory of the Chemistry and Technology of Light Auxiliary Chemicals, Shaanxi University of Science
& Technology, Xi'an 710021, Shaanxi, China; 2. The Northwest Research Institute of Chemical Industry Co., Ltd., Xi'an
710061, Shaanxi, China）
Abstract: BPS-BPA phenolic epoxy resin was synthesized by using bisphenol A phenolic resin (BPA
phenolic resin) and 4, 4-dihydroxydiphenylsulfone (BPS) as raw materials and epichlorohydrin as bridging
agent in the presence of a catalytic amount of tetrabutylammonium bromide (TBAB). Then, the chemical
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structure and relative molecular mass of target product were characterized by FTIR, HNMR, GPC and
EDS. The results showed that the target product was successfully prepared and showed good temperature
resistance, and its M w was 4355. In addition, the effects of reaction temperature, reaction time, material ratio
and NaOH dosage on the epoxy value of the target product were discussed. The optimum process
conditions for the target product obtained by orthogonal experimental design were as follows: reaction
temperature 110 ℃, reaction time 2.5 h, m(BPA phenolic resin)∶m(BPS)=1∶0.9, NaOH dosage 1.98 g.
Under these conditions, the epoxy value of the synthesized product was 0.718. Finally, an adhesive was
obtained by adding a polyamide resin curing agent to the target product. This adhesive had excellent
bonding properties with a maximum adhesion of 100.66 N and an interlayer bonding strength of 0.788 N/m,
which exhibited good adhesion to low-polarity polypropylene materials.
Key words: 4, 4-dihydroxydiphenylsulfon; bisphenol A phenolic resin; epoxy value; bonding properties

环氧树脂问世 60 多年来，以其价格低廉、成型 众多领域有着广泛的应用 [1-2] 。双酚 A 型环氧树脂作
工艺简单、优良的电气和力学性能等诸多优点，在 为高分子树脂行业中最基础的化学品之一，具有良

收稿日期：2019-06-25; 定用日期：2019-08-26; DOI: 10.13550/j.jxhg.20190593
基金项目：陕西省 2017 年重点研发计划项目（2017ZDXM-GY-087；2017GY-185）；陕西省教育厅服务地方专项计划项目（15JF011）
作者简介：郭 睿（1959—），男，教授，硕士生导师，E-mail：365726475@qq.com。联系人：李秀环（1994—），女，硕士生，E-mail：
1208284741@qq.com。